Soft Switching DC-DC Converter Simulation Using Simulink/Simscape
DOI:
https://doi.org/10.31272/ajece.10Keywords:
Buck, resonant converter, thermal model, EMI, soft switching, Simscape.Abstract
Generally, switching losses of power electronics converters are proportional to their operating frequency. Consequently, for high frequency DC-DC converter, zero voltage switching (ZVS) technique is preferable over hard switching. If switches transition from OFF to ON occurs when the voltage across the switching element is zero, it reduces switching losses that is combined with heat and Electro Magnetic Interference (EMI). Such technique is defined as soft switching. Resonant components L-C are used to produce soft switching for the proposed topology. The values of the resonant components are found by applying related equations that were obtained according to the circuit topology. Moreover, very little electromagnetic interference (EMI) produces with this type of converters due to soft switched, which can make the proposed converter suitable for communication applications. In order to ensure efficient resonant converter, the research focuses on modelling a circuit with the fewest components. The converter is simulated and the model validates its viability, with two IGBT thermal models via MATLAB/SIMSCAPE program.
References
S. Chakraborty, B. Kramer, and B. Krepski, “A review of power electronics interfaces for distributed energy systems towards achieving low-cost modular design,” Renewable and Sustainable Energy Reviews, vol. 13, no. 9, pp. 2323-2335, 2009, doi: 10.1016/j.rser.2009.05.005.
L. Tan, P. Liu, C. She, P. Xu, L. Yan, and H. Quan, “Heat dissipation characteristics of IGBT module based on flow-solid coupling,” Micromachines, vol. 13, no. 4, p. 554, 2022, doi: 10.3390/mi13040554.
J. Wolfle, M. Nietzsche, J. Richardt, and J. Roth-Stielow, “Junction temperature control system to increase the lifetime of IGBT-Power-modules in synchronous motor drives without affecting torque and speed,” in IEEE Open Journal of Power Electronics, vol. 1, pp. 273-283, 2020, doi: 10.1109/OJPEL.2020.3014443.
L. Wei, J. McGuire, and R. A. Lukaszewski, “Analysis of PWM frequency control to improve the lifetime of PWM inverter,” in IEEE Transactions on Industry Applications, vol. 47, no. 2, pp. 922-929, 2011, doi: 10.1109/TIA.2010.2103391.
A. S. Bahman, K. Ma, and F. Blaabjerg, “A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions,” 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2015, pp. 1209-1215, doi: 10.1109/APEC.2015.7104501.
W. Zhihong, S. Xiezu, and Z. Yuan, “IGBT junction and coolant temperature estimation by thermal model,” Microelectronics Reliability, vol. 87, pp. 168-182, 2018, doi: 10.1016/j.microrel.2018.06.018.
X. Xin and C. Zhang, “Junction temperature estimation model of insulated gate bipolar transistor power module in three-phase inverter,” IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, 2017, pp. 1267-1272, doi: 10.1109/IECON.2017.8216216.
H. Lim, J. Hwang, S. Kwon, H. Baek, J. Uhm, and G. Lee, “A study on real time IGBT junction temperature estimation using the NTC and calculation of power losses in the automotive inverter system,” Sensors, vol. 21, no. 7, p. 2454, 2021, doi: 10.3390/s21072454.
X. Lin, et al., “Design and analysis of the IGBT heat dissipation structure based on computational continuum mechanics,” Entropy, vol. 22, no. 8, p. 816, 2020, doi: 10.3390/e22080816.
J. H. Lee, Y. W. Son, and S. Chang, “Numerical analysis on natural convection heat transfer in a single circular fin-tube heat exchanger (part 2): correlations for limiting cases,” Entropy, vol. 22, no. 3, p. 358, 2020, doi: 10.3390/e22030358.
] P. Górecki, K. Górecki, R. Keisel, and M. Myśliwiec, “Thermal parameters of monocrystalline GaN Schottky diodes,” in IEEE Transactions on Electron Devices, vol. 66, no. 5, pp. 2132-2138, May 2019, doi: 10.1109/TED.2019.2907066.
Xin X. and Zhang C. Junction temperature estimation model of insulated gate bipolar transistor power module in three-phase inverter. IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, 2017, pp. 1267-1272, doi.org/10.1109/IECON.2017.8216216.
Wu, R., Wang, H., Pedersen, K. B., Ma, K., Ghimire, P., Iannuzzo, F., & Blaabjerg, F. A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations. in IEEE Transactions on Industry Applications, vol. 52, no. 4, pp. 3306-3314, July-Aug. 2016, doi.org/10.1109/TIA.2016.2540614.
Ahmed S. Ahmed, Riyadh G. Omar “INSULATED GATE BIPOLAR TRANSISTOR TEMPERATURE CALCULATION USING SIMSCAPE/SIMULINK ENVIRONMENT WITH VARIOUS SWITCHING FREQUENCY”, JEASD, vol. 28, no. 1, pp. 109–120, Jan. 2024, doi: 10.31272/jeasd.28.1.8.
Kumar, A. Suresh, and P. Krishna Reddy. "Design & Implementation of Zero Voltage Switching Buck Converter." Int. Journal of Engineering Research and Applications 4, no. 9 (2014).
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Copyright (c) 2024 Riyadh G. Omar, Ali H. Abduljabbar (Author)
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